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Dual-Phase, Quick-PWM Controller
for IMVP6+ CPU Core Power Supplies
4) Make the DC-DC controller ground connections as
shown in the standard application circuits. This dia-
gram can be viewed as having four separate ground
planes: input/output ground, where all the high-
power components go; the power ground plane,
where the GND pin and V DD bypass capacitor go;
the master’s analog ground plane where sensitive
analog components, the master’s GND pin, and V CC
bypass capacitor go; and the slave’s analog ground
plane where the slave’s GND pin and V CC bypass
capacitor go. The master’s GND plane must meet
the GND plane only at a single point directly
beneath the IC. Similarly, the slave’s GND plane
Chip Information
PROCESS: BiCMOS
must meet the GND plane only at a single point
directly beneath the IC. The respective master and
slave ground planes should connect to the high-
power output ground with a short metal trace from
GND to the source of the low-side MOSFET (the
middle of the star ground). This point must also be
very close to the output capacitor ground terminal.
5) Connect the output power planes (V CORE and sys-
tem ground planes) directly to the output filter
capacitor positive and negative terminals with multi-
ple vias. Place the entire DC-DC converter circuit as
close to the CPU as is practical.
Package Information
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages .
PACKAGE TYPE
48 TQFN-EP
PACKAGE CODE
T4877+6
DOCUMENT NO.
21-0144
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 45
? 2009 Maxim Integrated Products
Maxim is a registered trademark of Maxim Integrated Products, Inc.
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